Bookings close on February 4 for the Packaging & Label Association’s rescheduled two-day Technical Forum and Awards event in Melbourne on February 24-25. The event was postponed from September 2021 because of Covid.
Experts from companies including HP, DIC and Aldus will look at latest industry technologies and join panel discussions.
“15 speakers will be presenting the latest in technological development in our industry,” says the Flexible Packaging & Label Manufacturers Association’s (FPLMA). “Panel discussions will include prominent international companies such as MCC, DIC and GPI and discuss critical issues in today’s industry.”
The event includes ‘Infoflex’ - where industry partners host a meet and greet for each delegate, and an Awards Dinner evening at the Crown Palladium.
The full program can be viewed here.
2021 FPLMA Technical Forum & Awards
24th and 25th February, 2022
Melbourne Exhibition Centre
2 Clarendon St, South Wharf
Price (full pass) (includes Day 1, Day 2, Dinner)
Friday 25 Feb @ 6.00pm
Attire: Smart Business
Promenade, Crown Melbourne
8 Whitman St
Dinner only: A$170
Prices exclude GST
Closing: Friday 4 February 2022